Wide bandgap power semiconductor packaging materials components and reliability（Suganuma Katsuaki）（Woodhead Publishing 2018）

  • 书名：Wide bandgap power semiconductor packaging : materials, components, and reliability
  • 出版社：Woodhead Publishing
  • 作者：Suganuma, Katsuaki
  • 出版年份：2018
  • 电子书格式： pdf
  • 简介：Dive into the world of wide bandgap power semiconductors with Katsuaki Suganuma’s comprehensive guide. This book explores packaging materials, components, and reliability, offering invaluable insights for engineers and researchers. Learn about the latest advancements in wide bandgap semiconductor technology, including design considerations, material selection, and reliability testing methodologies. Ideal for professionals and students seeking a deeper understanding of power electronics and their applications in various industries. Gain expertise in optimizing performance and extending the lifespan of these crucial components. This book is your key to mastering the complexities of wide bandgap power semiconductor technology.
  • ISBN：9780081020944, 00810
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