RF and Microwave Microelectronics Packaging（Rick Sturdivant (auth.) Ken Kuang Franklin Kim Sean S. Cahill (eds.)）（Springer US 2010）

  • 书名：RF and Microwave Microelectronics Packaging
  • 出版社：Springer US
  • 作者：Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
  • 出版年份：2010
  • 电子书格式： PDF
  • 简介：Dive into the essential world of RF and microwave microelectronics packaging with this comprehensive guide from Springer US. Authored by Rick Sturdivant and edited by Ken Kuang, Franklin Kim, and Sean S. Cahill, this 2010 publication offers in-depth insights into design, materials, and manufacturing techniques. Learn about high-frequency circuit packaging, signal integrity, thermal management, and electromagnetic interference (EMI) shielding. Ideal for engineers, researchers, and students working with RF and microwave systems, this book provides practical solutions and advanced concepts for optimal performance. Improve your understanding of complex packaging challenges and master the latest advancements in this dynamic field.
  • ISBN：9781441909831
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